Peter Griehsnig, Board Member & Chief Technology Officer (CTO), AT&S

Peter Griehsnig graduated from Graz University of Technology with a doctorate in applied physics. He initially gained his professional experience at PHILIPS Components in Lebring before becoming a key figure in the AT&S success story in Asia for two decades. As Chief Operating Officer (COO), he helped build up the new Shanghai site from 2001 and shaped it until 2023, when he returned to the headquarters in Leoben as CTO and member of the Management Board.

Jan Preibisch, Vice President Corporate Strategy, AT&S

Dr. Jan Preibisch is VP Corporate Strategy at AT&S in Leoben, Austria, shaping strategic direction in advanced electronics and IC substrates. With a Ph.D. in Electrical Engineering from TU Hamburg and more than 10 years’ experience in the semiconductor industry, he brings deep technical insight and market expertise. Jan has contributed to award-winning research and speaks regularly at industry events, sharing practical perspectives on innovation, strategy, and emerging trends.

Hannes Voraberger, Vice President Corporate R&D, AT&S

Hannes Voraberger studied industrial chemistry at Graz University of Technology. In 2004 he joined AT&S in Leoben, went on to establish a local R&D at AT&S Shanghai (China) and returned to Austria in 2008 where he took over the responsibility for Intellectual Property and the financing of R&D projects. He became Vice President Corporate R&D in 2022. In the course of his academic and professional career Hannes Voraberger published several scientific papers and patents.

Markus Leitgeb, Head of R&D BU ME, AT&S

Markus Leitgeb has joined AT&S in December 2000. He is currently leading the R&D team for Microelectronics Packaging. He has filed more than 100 patents and has published several papers in the field of PCBs and Packaging. In 2014 he has been awarded with “IPC APEX EXPO Best International Paper” and in 2023 with 3D InCites “Engineer of the Year”.  He holds a Master’s Degree in Polymer Engineering from the Technical University in Leoben and serves as a committee member in ECTC’s Packaging Technology group.

Jérôme Azémar, Technical Sales Director, Yole Group

Jérôme Azémar has been part of the company for twelve years and is the author of numerous analyses and publications covering advanced packaging, power electronics, and semiconductor manufacturing. Upon graduating from INSA Toulouse (FRA) with a Master’s in Microelectronics and Applied Physics, he joined ASML in Veldhoven (NED). During this time, he acquired photolithographic skills which he then honed at STMicroelectronics (FRA). His mission is to develop Yole Group’s business in the semiconductor industry.

Christian Vockenberger, Head of Electronics Development Services, AT&S

Christian Vockenberger brings more than 20 years of experience in PCB and electronics manufacturing. Throughout his tenure at AT&S, he has held various technical roles across multiple company sites, with a strong focus on Quality, New Product Introduction (NPI), and Engineering. Since 2011, he has played a key role in the development and commercialization of AT&S’s Embedded Component Packaging (ECP®) technology and leads a team of dedicated engineers. His background is Chemical Engineering. He is the inventor of several patents in the field of PCB and embedding technologies.

Rajesh Mandamparambil, Technical Director – Package Pathfinding, NXP

Rajesh Mandamparambil is Technology Director for Package Pathfinding at NXP Semiconductors, based in Nijmegen. With over 20 years of experience across academia, applied research, and industry innovation, he holds a Ph.D. in Photonics and an MBA. Prior to joining NXP in 2016, he led photonics and sensing R&D programs at TNO in the Netherlands. At NXP, he drives innovation in advanced packaging for millimeter-wave analog and mixed-signal devices, focusing on heterogeneous integration, co-design methodologies, and next-generation radar and communication systems.

Wolfram Zotter, Director Application Engineering BU ES, AT&S

After his graduation in IT & Economics, Wolfram Zotter started his career with AT&S in 2001 in Fohnsdorf as a Product Engineer. In 2004 he transferred to Leoben to support global customers as a Sales Engineer. Three years later he took the opportunity to become the very first employee of AT&S Americas LLC and moved to San Jose as regional Sales Engineering support. Over the period of ten years he built the Americas Engineering team and contributed to the development of the sales region, acquiring some of our current key accounts.

Rainer Frauwallner, Director Electronics Service Hub, AT&S

Rainer Frauwallner has more than 15 years of experience in the electronics industry, spanning the automotive, industrial and semiconductor sectors – including more than a decade at AT&S. He has held various roles across engineering and product management, with a particular focus on AT&S’s embedding technologies. Today, he leads the AISS team, driving design, simulation and product development services. He holds a Master of Science in Advanced Electronic Engineering from FH Joanneum Kapfenberg and an MBA in General Management from FH Campus 02 Graz.

Marina Hornasek-Metzl, Vice President Corporate ESG & Quality, AT&S

Marina Hornasek-Metzl brings 30 years of expertise in sustainability and technical marketing. Since 2023 at AT&S’ newly established Corporate ESG Team,  she oversees ESG Strategy, Regulatory Reporting, Decarbonisation, Energy Efficiency and Security, Circular Economy, Health & Safety, Social Sustainability, and Supply Chain topics. She holds a Doctorate in Economics and Health Sciences, a Master’s in International Economics and Business Administration, and completed the Business & Sustainability Programme at the University of Cambridge.

Markus Frewein, Section Manager Product & Process Simulation, AT&S

Markus Frewein is an experienced simulation and modeling expert in electronic systems with a strong background in polymer engineering. With AT&S since 2014, he also is the author and contributor to multiple peer-reviewed publications and IP in the field of warpage optimization, lifetime prediction and electronics reliability. He holds a Master degree in Polymer Engineering and Science from the Montanuniversität Leoben.

Herbert Pairitsch, Director Technology & Innovation, Infineon

DI Herbert Pairitsch holds a degree in electrical engineering from the Graz University of Technology, from where he graduated in the year 1985. In 1986 he started his career at Infineon Technologies Austria AG (former Siemens HL) and held leading positions at various manufacturing and development departments. Since 2014 he served as divisional Head of R&D Funding PSS (Power and Sensor Systems). His responsibilities include the coordination of national and international research projects in the context of energy efficient electronics (e.g. LED-lighting, Smart Grids, e-Mobility) and new semiconductor materials (e.g. SiC, GaN).