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Peter Griehsnig, Board Member & Chief Technology Officer (CTO), AT&S
Peter Griehsnig graduated from Graz University of Technology with a doctorate in applied physics. He initially gained his professional experience at PHILIPS Components in Lebring before becoming a key figure in the AT&S success story in Asia for two decades. As Chief Operating Officer (COO), he helped build up the new Shanghai site from 2001 and shaped it until 2023, when he returned to the headquarters in Leoben as CTO and member of the Management Board.
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Hannes Voraberger, Vice President Corporate R&D, AT&S
Hannes Voraberger studied industrial chemistry at Graz University of Technology. In 2004 he joined AT&S in Leoben, went on to establish a local R&D at AT&S Shanghai (China) and returned to Austria in 2008 where he took over the responsibility for Intellectual Property and the financing of R&D projects. He became Vice President Corporate R&D in 2022. In the course of his academic and professional career Hannes Voraberger published several scientific papers and patents.
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Markus Leitgeb, Head of R&D ME, AT&S
Markus Leitgeb has joined AT&S in December 2000. He is currently leading the R&D team for Microelectronics Packaging. He has filed more than 100 patents and has published several papers in the field of PCBs and Packaging. In 2014 he has been awarded with “IPC APEX EXPO Best International Paper” and in 2023 with 3D InCites “Engineer of the Year”. He holds a Master’s Degree in Polymer Engineering from the Technical University in Leoben and serves as a committee member in ECTC’s Packaging Technology group.
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Jérôme Azémar, Technical Sales Director, Yole Group
Jérôme Azémar has been part of the company for twelve years and is the author of numerous analyses and publications covering advanced packaging, power electronics, and semiconductor manufacturing. Upon graduating from INSA Toulouse (FRA) with a Master’s in Microelectronics and Applied Physics, he joined ASML in Veldhoven (NED). During this time, he acquired photolithographic skills which he then honed at STMicroelectronics (FRA). His mission is to develop Yole Group’s business in the semiconductor industry.
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Christian Vockenberger, Head of Electronics Development Services, AT&S
Christian Vockenberger brings more than 20 years of experience in PCB and electronics manufacturing. Throughout his tenure at AT&S, he has held various technical roles across multiple company sites, with a strong focus on Quality, New Product Introduction (NPI), and Engineering. Since 2011, he has played a key role in the development and commercialization of AT&S’s Embedded Component Packaging (ECP®) technology and leads a team of dedicated engineers. His background is Chemical Engineering. He is the inventor of several patents in the field of PCB and embedding technologies.
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Wolfram Zotter, Director Application Engineering BU ES, AT&S
After his graduation in IT & Economics, Wolfram Zotter started his career with AT&S in 2001 in Fohnsdorf as a Product Engineer. In 2004 he transferred to Leoben to support global customers as a Sales Engineer. Three years later he took the opportunity to become the very first employee of AT&S Americas LLC and moved to San Jose as regional Sales Engineering support. Over the period of ten years he built the Americas Engineering team and contributed to the development of the sales region, acquiring some of our current key accounts.
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Rainer Frauwallner, Director Advanced Interconnect Solution Services, AT&S
Rainer Frauwallner has more than 15 years of experience in the electronics industry, spanning the automotive, industrial and semiconductor sectors – including more than a decade at AT&S. He has held various roles across engineering and product management, with a particular focus on AT&S’s embedding technologies. Today, he leads the AISS team, driving design, simulation and product development services. He holds a Master of Science in Advanced Electronic Engineering from FH Joanneum Kapfenberg and an MBA in General Management from FH Campus 02 Graz.
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Marina Hornasek-Metzl, Vice President Corporate ESG & Quality, AT&S
Marina Hornasek-Metzl brings 30 years of expertise in sustainability and technical marketing. Since 2023 at AT&S’ newly established Corporate ESG Team, she oversees ESG Strategy, Regulatory Reporting, Decarbonisation, Energy Efficiency and Security, Circular Economy, Health & Safety, Social Sustainability, and Supply Chain topics. She holds a Doctorate in Economics and Health Sciences, a Master’s in International Economics and Business Administration, and completed the Business & Sustainability Programme at the University of Cambridge.
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Gerald Weis, Section Manager Hardware Development, AT&S
Gerald Weis works as section manager of the hardware development center at AT&S. Together with his team he supports development of IC substrates, complex PCBs and packages since about 10 years. His focus is on miniaturization, electrical and thermal performance and cost effectiveness of the developed applications. Beside the management, he supports automation in various EDA tools as well as electrical and thermal simulations. His background is electronics. Additionally, he gives lectures in electronic engineering at an Austrian university.
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