AT&S Tech Days 2025

Agenda

Tuesday, November 4, 2025

9:00 AM	Arrival & Registration Red Bull Wing – Coffee & Snacks
10:00 AM	Welcome & Overview
10:10 AM	AT&S Technology Directions Peter Griehsnig, CTO, AT&S AG As digitalization, AI, and renewable energy reshape the electronics landscape, customers face increasing demands for performance, efficiency, and scalability. AT&S supports these evolving needs with advanced substrate and PCB technologies that enable increased I/O density, high-speed signal integrity, and low-loss power delivery - empowering our partners to build next-generation electronic systems.
10:25 AM	Electronic Market – Forecast, Trends & Applications Jan Preibisch, Vice President Corporate Strategy, AT&S AG
10:55 AM	Coffee Break
11:20 AM	Advanced Packaging Solutions* Hannes Voraberger, Vice President Corporate R&D, AT&S AG
11:50 AM	Latest Developments in IC Substrates* Markus Leitgeb, Head of R&D Business Unit Microelectronics, AT&S AG The IC Susbtrate is the foudation of every Advanced Packaging Solution. This talk will outline AT&S development work in IC Subtrates to overcome the challenges for future Microelectronics Packaging in terms of Warpage Control, Die 2 Die Interconnections as well as Power Delivery.
12:20 PM	Networking Lunch
1:20 PM	Generative AI: High Performance Workload Demands & Impacts on Semiconductor & Packaging Industry Jérôme AZEMAR, Technical Sales Director, Yole Développement In this talk, we will explore how Generative AI is influencing compute, memory, and advanced packaging markets, situating these shifts within broader semiconductor trends. We will also examine the key assumptions about the future that could pose risks to even the most well-positioned players in the current AI wave.
1:50 PM	Miniaturized, Efficient, and Seamlessly Integrable: Power Supply Solutions Enabled by Embedded Die Technology Christian Vockenberger, Head of Electronics Development Services, AT&S AG
2:15 PM	Topic to Be Confirmed Rajesh Mandamparambil, NXP
2:45 PM	Coffee Break
3:10 PM	Interconnect Solutions* Wolfram Zotter, Director Application Engineering BU Electronics Solutions, AT&S AG As electronic systems evolve toward higher performance and miniaturization; advanced interconnect solutions are key to enabling next-generation applications across industries. This presentation explores how AT&S leverages reliable and cutting-edge PCB technologies, to meet the demands of high-speed, power and thermally challenged and high-reliability systems. Attendees will gain insights into tailored solutions across multiple markets and how collaborative design can unlock new possibilities in system integration.
3:35 PM	AT&S Electronic Development Services to Support Customer Product Realization* Rainer Frauwallner, Director Advanced Interconnect Solution Services, AT&S AG
4:00 PM	Sustainable Manufacturing (ESG) – Green Tech* Marina Hornasek-Metzl, Vice President Corporate ESG and Quality, AT&S AG
4:30 PM	Activity Program Red Bull Ring
7:00 PM	Get Together – Dinner

Wednesday, November 5, 2025

9:00 AM	Welcome & Overview
9:10 AM	Workshops Please select one of the two workshops you wish to attend during registration. PCB: Designing with Purpose for Effective PCB Manufacturing, Assembly & Cost Gerald Weis, Section Manager Hardware Development, AT&S AG This workshop primarily focuses on practical design strategies that enhance manufacturability, streamline assembly processes, and optimize cost efficiency in PCB production. *ICS: Simulation-Driven Warpage Optimization for Substrates & PCBs** Markus Frewein, Section Manager Product & Process Simulation, AT&S AG This workshop is centered around simulation-based approaches to minimize warpage in advanced IC substrates, with a strong emphasis on process reliability and performance. *Please note: A minimum of 10 participants is required for this workshop.
10:40 AM	Coffee Break
11:10 AM	Topic to Be Confirmed Herbert Pairitsch, Infineon
11:45 AM	Networking Lunch
12:45 PM	Departure to Leoben-Hinterberg (Shuttle service available)
1:30 PM	Line Tour Choose your tour during registration. Line Tour: PCB Production Line Tour: IC Substrate Production – Cleanroom Tour (Limited number of participants – first come, first served)
3:30 PM	End

* This work is funded/partly funded by the Austrian Federal Ministry of Innovation, Mobility and Infrastructure, the Austrian Federal Ministry of Economy, Energy and Tourism, and implemented by austria wirtschaftsservice (aws) and the Austrian Research Promotion Agency (FFG) in the frame of the Important Project of Common European Interest (IPCEI)on Microelectronics and Communication Technologies (ME/CT).