AT&S Tech Days 2025

Agenda

Tuesday, November 4, 2025

9:00 AM	Arrival & Registration Red Bull Wing – Coffee & Snacks
10:00 AM	Welcome & Overview
10:10 AM	AT&S Technology Directions Peter Griehsnig, CTO, AT&S AG As digitalization, AI, and renewable energy reshape the electronics landscape, customers face increasing demands for performance, efficiency, and scalability. AT&S supports these evolving needs with advanced substrate and PCB technologies that enable increased I/O density, high-speed signal integrity, and low-loss power delivery — empowering our partners to build next-generation electronic systems.
10:25 AM	PCBs in Transition: From Commodity to Catalyst in a Localized Global Market Jan Preibisch, Vice President Corporate Strategy, AT&S AG The printed circuit board (PCB) market is experiencing steady growth, driven by global economic expansion and the accelerating shift toward electrification. While PCBs are treated as commodities in some sectors, they serve as critical enabling technologies in others, highlighting their dual role in modern electronics. As global supply chains face pressure to localize, the industry must navigate complex challenges in cost, innovation, and resilience — making the future of PCB manufacturing both promising and demanding.
10:55 AM	Coffee Break
11:20 AM	Advanced Packaging Solutions* Hannes Voraberger, Vice President Corporate R&D, AT&S AG
11:50 AM	Latest Developments in IC Substrates* Markus Leitgeb, Head of R&D Business Unit Microelectronics, AT&S AG The IC substrate is the foundation of every advanced packaging solution. This talk will outline the AT&S development work in IC substrates to overcome the challenges for future microelectronics packaging in terms of warpage control, die 2 die interconnections as well as power delivery.
12:20 PM	Networking Lunch
1:20 PM	Generative AI: High Performance Workload Demands & Impacts on Semiconductor & Packaging Industry Jérôme AZEMAR, Technical Sales Director, Yole Group In this talk, we will explore how Generative AI is influencing compute, memory, and advanced packaging markets, situating these shifts within broader semiconductor trends. We will also examine the key assumptions about the future that could pose risks to even the most well-positioned players in the current AI wave.
1:50 PM	Miniaturized, Efficient, and Seamlessly Integrable: Power Supply Solutions Enabled by Embedded Die Technology Christian Vockenberger, Head of Electronics Development Services, AT&S AG Global power demand is rising — driven by e-mobility, renewables, and growing AI integration. Efficient power supply and conversion are now critical. This talk presents AT&S’s embedded die technology, enabling direct integration of power devices into PCBs or substrates. It shortens the electrical path, reduces losses, boosts performance, and allows double-sided heat dissipation. AT&S offers this advanced packaging for both printed circuit boards and IC substrates.
2:15 PM	Challenges in Heterogeneous Integration for Analog and Mixed Signal Devices Rajesh Mandamparambil, Technology Director – Package Pathfinding, NXP Semiconductors This talk explores the evolving landscape of advanced semiconductor packaging, focusing on heterogeneous integration for analog and mixed-signal devices. It highlights the increasing complexity driven by applications in automotive radar, communication infrastructure, and millimeter-wave technologies.
2:45 PM	Coffee Break
3:10 PM	Interconnect Solutions* Wolfram Zotter, Director Application Engineering BU Electronics Solutions, AT&S AG As electronic systems advance, high-performance interconnects are essential for next-gen applications. This presentation highlights how AT&S uses cutting-edge PCB technologies to meet demands in speed, power, thermal management, and reliability. Attendees will discover tailored solutions across industries and how collaborative design enables new system integration possibilities — addressing challenges in high-speed and power-critical environments with innovative, reliable packaging approaches.
3:35 PM	The AT&S Electronics Service Hub: Where Challenges Meet Expertise* Rainer Frauwallner, Director Electronics Service Hub, AT&S AG Discover how the AT&S Electronics Service Hub transforms customer challenges into innovative solutions. In this session, Rainer Frauwallner presents the department’s established capabilities in product and process simulation, hardware development and product development services. Learn how this strategic unit supports customers by enabling them to focus fully on their innovation goals, while relying on a trusted team to handle the technical intricacies – from concept to realization.
4:00 PM	Building a Greener Future Through Sustainable Manufacturing and GreenTech* Marina Hornasek-Metzl, Vice President Corporate ESG and Quality, AT&S AG Traditional manufacturing has long been associated with high energy consumption, waste generation, and carbon emissions. While it has driven economic growth and technological advancement, it has also contributed significantly to environmental harm. Today, we know that we can continue to grow responsibly if we embrace sustainable manufacturing and invest in GreenTech.
4:30 PM	Activity Program Red Bull Ring
7:00 PM	Get Together – Dinner

Wednesday, November 5, 2025

9:00 AM	Welcome & Overview
9:10 AM	Workshops Please select one of the two workshops you wish to attend during registration. PCB: Designing with Purpose for Effective PCB Manufacturing, Assembly & Cost Gerald Weis, Section Manager Hardware Development, AT&S AG This workshop primarily focuses on practical design strategies that enhance manufacturability, streamline assembly processes, and optimize cost efficiency in PCB production. ICS: Simulation-Driven Warpage Optimization for Substrates & PCBs Markus Frewein, Section Manager Product & Process Simulation, AT&S AG This workshop is centered around simulation-based approaches to minimize warpage in advanced IC substrates, with a strong emphasis on process reliability and performance. Please note: A minimum of 10 participants is required for this workshop.
10:40 AM	Coffee Break
11:10 AM	Power Electronics – The Pathway from Underdog to Hero Herbert Pairitsch, Director Technology & Innovation, Infineon Technologies AG 30 years ago, power semiconductors had 5% of the semiconductor market. Today it’s about 10% with a bright future perspective. Examples will be given to explain the challenge between the strong need for innovation and severe price pressure in power semiconductor R&D and production.
11:45 AM	Networking Lunch
12:45 PM	Departure to Leoben-Hinterberg (shuttle service available)
1:30 PM	Line Tour Choose your tour during registration. Line Tour: PCB production Line Tour: IC substrate production – cleanroom tour (limited number of participants – first come, first served)
3:30 PM	End

* This work is funded/partly funded by the Austrian Federal Ministry of Innovation, Mobility and Infrastructure, the Austrian Federal Ministry of Economy, Energy and Tourism, and implemented by austria wirtschaftsservice (aws) and the Austrian Research Promotion Agency (FFG) in the frame of the Important Project of Common European Interest (IPCEI)on Microelectronics and Communication Technologies (ME/CT).