Agenda
Printable Agenda:
Agenda.pdf
Registration & Welcome Coffee
Welcome – Opening
Cooperation – shared event IPCEI ME 1 AT partners & ESBS
Hannes Voraberger, AT&S; Stefan Rohringer, ESBS
What is an IPCEI – Key Features
Hannes Voraberger, AT&S; Stefan Rohringer, ESBS
Austria and IPCEI – Status Quo of IPCEI Processes, Outlook and Strategic Perspectives
Falko Loher, Federal Ministry for Climate Action, Environment, Energy, Mobility, Innovation and Technology (BMK)
COFFEE BREAK
Austrian RTO in IPCEI ME 2 – Focus on SME Aspect
Christina Hirschl, SAL
Panel Discussion – Implementation of IPCEIs in Local Ecosystems – the Benefit for SMEs
Participants: Michael Jerne, NXP; Hannes Voraberger, AT&S; Josef Moser, Infineon Technologies Austria AG; Horst Pflügl, AVL; Gerald Murauer, SAL
European Chips ACT
Pillar 1: Chips for EU Initiative – Michael Wiesmüller, Federal Ministry for Climate Action, Environment, Energy, Mobility, Innovation and Technology (BMK)
Pillar 2: Framework for Supply Security – Thomas Saghi, Federal Ministry of Labour and Economy (BMAW)
LUNCH
About the IPCEI ME 1 – Joining European Forces
IPCEI funding – a successful 2b EUR Misunderstanding
Peter van Staa, Bosch and Coordinator IPCEI ME 1
The IPCEI on Microelectronics: Set up & Summarized Technical Results
Josef Moser, Infineon Technologies Austria AG
IPCEI ME 1– The Austrian Contribution to IPCEI ME 1
Marcus Borrmann, NXP; Michael Gößler, AT&S; Martin Mischitz, Infineon Technologies Austria AG
COFFEE BREAK
The Austrian Ecosystem
ESBS-Austria – Stefan Rohringer, ESBS
Silicon Alps Cluster – Robert Gfrerer, Silicon Alps Cluster
SAL (Silicon Austria Labs) cooperation model – Gerald Murauer, SAL
Strengthening of the national semiconductor value chain (Lab2Fab)
Stella Mitsche, Austrian Promotional Bank
Wrap Up & End of Austrian IPCEI Day
Dinner
Thursday, January 26, 2023
Registration & Welcome Coffee
AT&S – Introduction and Research & Development Focus Areas
Overview AT&S IPCEI ME 1
Hannes Voraberger, AT&S
FID of Organic Substrate Cores for Power Packages
Mike Morianz, AT&S
Novel Packaging Concepts for High Frequency
Erich Schlaffer, AT&S
BREAK
Collaboration: IFAT – AT&S
Clement Chevalier, Infineon Technologies Austria AG & Wolfgang Schrittwieser, AT&S
New Technology Node Test and Reference Boards
Sabine Liebfahrt, AT&S
Industry 4.0 – Resource-Efficient Production and Recycling Technologies
Konstantin Kern, AT&S
LUNCH
1:1 Sessions for Design & Prototyping & Line Tours
Please note the information on this program item under additional information
Closing of AT&S Prototyping Workshop on IPCEI ME 1 Results
Export event as appointment