Agenda

While signal speed/integrity, density requirements, miniaturized features, and thermal performance can be complementary in some cases, they are often in conflict with one another, especially when it comes to thick boards with complex form factors and aspect ratios. In recent and future applications, these conflicting goals become even clearer and standard concepts are no longer able to cope with the new challenges and constraints. HDMP and Z-Interconnect technologies are AT&S’s state-of-the-art answer to the challenges that result from the need for ever-increasing numbers of layers and thicker boards and, simultaniously, higher density, signal speed and frequency, which require miniaturized functions and tolerances.

Where rigid PCB combinations are no longer sufficient, flex & rigid flex PCBs are the first choice. Requirements regarding the miniaturization of printed circuit boards are rapidly increasing. A complex layer structure and constantly decreasing lines and spacing have enabled exciting developments over the past couple of years. Although new technical processes are now possible as a result of lines and spacing of 45 μm, sooner or later this scope will no longer be enough due to the technical and physical limitations. With the high flexibility of flex and rigid flex technologies, AT&S can realize the most innovative and reliable applications on the market.

Modern electronics are high-end products based on complex PCB manufacturing processes and assembly technologies. Emerging printed circuit board technologies enable functional integration on miniaturized volume. However, the development requires a complex toolset and a cross-disciplinarily skilled development team. Design suite interactions, constraint settings, board stack-ups and manufacturing rules might further extend the development cycle. Customer training, simulation solutions, as well as long-term experience, help to develop advanced electronics in terms of performance, time and cost. In this talk, we will present the actual capabilities and advantages of the internal design solution of AT&S.

Industry innovation has accelerated with new architectures driven by chiplets and heterogeneous packaging technologies that require more advanced PCBs, substrates, and modules. AT&S is focused on providing highly integrated and efficient interconnect solutions driven by four key areas discussed in this session: interconnect density, functional integration, mechanical integration, and customized solutions that provide improved performance, miniaturization and differentiation. Technologies that can leverage high-speed materials, cavities, embedding, all-in-one integration, and 5G performance will be presented.

The flatness of bare and assembled printed circuit boards and substrates is a key requirement in the electronics industry. The processability and reliability of electronic products are highly affected by warpage, which should thus be reduced to a minimum. By using finite element simulation, it is possible to predict the warpage of a product before building physical samples. AT&S simulation tools significantly reduce the time to market, eliminate additional design iterations and physical builds, and reduce the total cost of products.

AT&S is a leader in the integration of components into a printed circuit board and provides innovative packaging technologies that help overcome some of the current challenges in microelectronics. Currently, we are investigating new solutions and technologies such as Emmbedded Component Packaging to help in various applications by increasing the functionality of circuit boards or modules.

5G networks enable wireless connections between vehicles, infrastructure, network services, and other road users such as cyclists and pedestrians. Smart factories will use similar technologies to digitize their production facilities and processes. In automated driving, radar applications at 79 GHz and beyond make sure that cars can “see” in high definition. 5G and radar applications are pushing RF components into new designs, new materials, new packages, new substrates and improved PCB concepts. At AT&S, we are at the forefront of answering these challenges by proposing novel solutions for RF devices.

IC substrates are increasingly becoming a key component for modularization and miniaturizing electronic products, particularly mobile, processors, and automotive modules. Given the range of module technologies being developed, we can offer lower-cost HDI and mSAP SLP substrates as well as advanced substrates and buildup substrates with advanced high-speed materials and high-volume manufacturing lines and expertise. This session will offer more insight into the range of substrate capabilities that can be offered for low, medium, and high-density substrates and modules as well as an outlook on future developments.

Today’s highly differentiated systems require a wider range of toolbox functions and system solutions to deliver the necessary performance and miniaturization for new computing, communications and consumer devices. This session will explore ways to meet your application’s requirements by leveraging the capabilities you hear about in the technical presentations here at the Tech Days. We are thinking about solutions that go beyond traditional PCB capabilities.