Agenda

The explosive growth in the data generated and increasing demand for computing power, global network traffic, and digital transformation are further driving the adaption of electronics and semiconductor devices. The need for better performing and smarter devices with advanced functionality that can meet high bandwidth requirements, faster speeds and more efficient power consumption are driving the industry to further develop new and innovative technologies, many of which are made possible by organic substrates. This presentation will focus on global market trends and highlight key trends and applications in the semiconductor industry, the increased need and growth of modularization and heterogeneous integration, and the importance of advanced interconnect solutions.

While signal speed/integrity, density requirements, miniaturized features, and thermal performance can be complementary in some cases, they are often in conflict with one another, especially when it comes to thick boards with complex form factors and aspect ratios. In recent and future drafts, these conflicting goals become even clearer and standard concepts are no longer able to cope with the new challenges and constraints. HDMP and Z-Interconnect technologies are AT&S's state-of-the-art answer to the increasing challenges that result from the combination of an ever-increasing number of layers/board thickness with the high density, signal speed/frequency that requires miniaturized functions and tolerances.

Industry innovation has accelerated with new architectures driven by chiplets and heterogeneous packaging technologies that require more advanced PCBs, substrates, and modules. AT&S is focused on providing highly integrated and efficient interconnect solutions driven by four key areas discussed in this session: interconnect density, functional integration, mechanical integration, and customized solutions that provide improved performance and miniaturization and differentiation. Technologies that can leverage high-speed materials, cavities, embedding, all-in-one integration, and 5G performance will be presented.

Modern electronics applications are high-end products based on complex PCB manufacturing processes and assembly technologies. The emerging printed circuit board technologies enable functional integration on miniaturized volume. However, the development requires a complex toolset and an interdisciplinary skilled development team. Interactions with the design suite, constraint settings, board stack-ups, and manufacturing rules can further add to the development cycle. Customer training, simulation solutions, and many years of experience help develop advanced electronics in connection with performance, time, and costs. In this lecture, we will introduce you to the possibilities and advantages of the internal design solution from AT&S.

ADAS systems for processing and sensing require novel interconnect solutions for main PCBs and modules. Technical insight into the AT&S technology roadmap and vision for next-generation V2x communication solutions, ADAS computing and autonomous vehicle control, high-resolution Radar systems, and high-performance camera systems will be discussed. We will guide you from today's state-of-the-art technologies towards the AT&S vision of modularization and More-than-Moore integration technologies.

Today's more custom systems and devices require a wider range of toolbox functions and system solutions to deliver the performance and size of new Computing, Communications, and Consumer devices. This session will explore ways to meet your application's requirements by leveraging the capabilities you see over these two days of technical presentations and speakers and thinking about solutions that go beyond traditional PCB capabilities.

IC substrates are increasingly becoming a key component for modularization and miniaturizing electronic products, particularly mobile, processors, and automotive modules. Given the range of module technologies being developed, we can offer lower-cost HDI and mSAP SLP substrates as well as advanced substrates and buildup substrates with advanced high-speed materials and high-volume manufacturing lines and expertise. This session will offer more insight into the range of substrate capabilities that can be offered for low, medium, and high-density substrates and modules as well as an outlook into future developments.

AT&S is a leader in the integration of components into a printed circuit board and provides innovative packaging technologies that help overcome some of the current challenges in microelectronics. Currently, we are investigating new ways and solutions for technologies to help in various applications for increased functionality of the circuit board or module.

The flatness of bare and assembled printed circuit boards and substrates are key requirements in the electronics industry. The processability and reliability of electronic products are highly affected by warpage and thus should be reduced to a minimum. By using finite element simulation, it is possible to predict the warpage of a product before building physical samples. The AT&S simulation tools significantly reduce the time to market, eliminate additional design iterations and physical builds, and finally, reduce the total cost of products.