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Tuesday, September 14, 2021
09:00 am

Welcome & Overview
Peter Schneider, Chief Sales Officer

09:20 am

Market Trends and Industry Drivers for Advanced Interconnect Technologies
Rozalia Beica, Senior Director Business Line Semiconductor

10:00 am

Miniaturization: More than simply smaller PCBs
Ifis Abderrazzaq, Programme Manager Technology Development

11:00 am

Heterogeneous Module Integration Concepts
Markus Leitgeb, Manager R&D

12:00 pm

AT&S electronic development services to support customer product realization
Patrick Fleischhacker, Hardware Development Engineer Design Services

01:00 pm

Automotive – on the verge towards new PCB and substrate technologies
Harald Gall, Director Business Line Automotive

Wednesday, September 15, 2021
09:00 am

Achieving your Advanced PCB system solutions
Rainbow Yuan, Director Business Line 3C

10:00 am

IC Substrates & Modules manufacturing - technology roadmap, process capabilities, engineering support and opportunities for customer collaboration
Lio Li, Technology Integration Manager

11:00 am

PCB+ Embedding Components Technology as a enabler of higher integration of functions and miniaturization
Hubert Haidinger, Director Product Engineering

12:00 pm

Warpage simulations for improved PCB design and production
Markus Frewein, Simulation Engineer Process & Product Simulation

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